Encapsulation protection of PCB board and FPC soft board parts, reinforcement of camera module, fingerprint recognition module dispensing IC chip, component underfill and component encapsulation shell frame dispensing.
Red phosphor, dam, precision coating, etc.
LED lens, LENS, TV backlight strip, automatic high-speed dispenser. High-speed surface mount dispensing, edge packaging, surface packaging, dispensing UV glue, epoxy glue red glue, bottom filling and other processes.
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